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National Repository of Grey Literature 2 records found  Search took 0.00 seconds. 
Optimization of deep reactive ion etching process
 Houška, David ; Hrdý, Radim (referee) ; Prášek, Jan (advisor)
This bachelor thesis deals with optimization of cryogenic and Bosch deep reactive ion etching (DRIE) processes. The thesis describes characterization of silicon etching methods, the principle of DRIE and the influence of individual parameters on the resulting etch profile. Based on the analysis of fabricated samples using scanning electron microscopy (SEM), both processes were optimized to create narrow microstructures with diameters ranging from 1 to 16 µm with the highest achieved depth-to-width ratio of 28:1 on a silicon substrate. Furthermore, surface roughness was analyzed using atomic force microscopy (AFM) and the presence of fluorine residues by X-ray photoelectron spectroscopy (XPS) in structures etched by both processes.
Detailed record
Optimization of deep reactive ion etching process
 Houška, David ; Hrdý, Radim (referee) ; Prášek, Jan (advisor)
This bachelor thesis deals with optimization of cryogenic and Bosch deep reactive ion etching (DRIE) processes. The thesis describes characterization of silicon etching methods, the principle of DRIE and the influence of individual parameters on the resulting etch profile. Based on the analysis of fabricated samples using scanning electron microscopy (SEM), both processes were optimized to create narrow microstructures with diameters ranging from 1 to 16 µm with the highest achieved depth-to-width ratio of 28:1 on a silicon substrate. Furthermore, surface roughness was analyzed using atomic force microscopy (AFM) and the presence of fluorine residues by X-ray photoelectron spectroscopy (XPS) in structures etched by both processes.
Detailed record

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